US Patent Issued to International Business Machines on Sept. 22 for "MRAM device with hexagonal shaped electrodes" (New York Inventors)

Posted On: 2026-09-24

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,570, issued on Sept. 22, was assigned to International Business Machines Corp. (Armonk, N.Y.). "MRAM device with hexagonal shaped electrod... Read More

US Patent Issued to Regents of the University of Minnesota, Government of the United States of America and Theiss Research on Sept. 22 for "Scalable spintronic devices formed on silicon wafers" (Minnesota, Maryland, California Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,571, issued on Sept. 22, was assigned to Regents of the University of Minnesota (Minneapolis) and Government of the United States of Americ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Memory device including bottom electrode bridges and method of manufacture" (Taiwanese, American Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,572, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory device including bottom el... Read More

US Patent Issued to Imec vzw on Sept. 22 for "Quantum bit chip having a stack of qubit wafers and spacer wafers, and a method for fabricating the quantum bit chip" (Belgian Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,573, issued on Sept. 22, was assigned to Imec vzw (Leuven, Belgium). "Quantum bit chip having a stack of qubit wafers and spacer wafers, a... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Semiconductor device, memory cell and method of forming the same" (Taiwanese Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,574, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device, memory cell... Read More

US Patent Issued to HANSOL CHEMICAL on Sept. 22 for "Semiconductor layer, method for manufacturing same, and transistor comprising same" (South Korean Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,575, issued on Sept. 22, was assigned to HANSOL CHEMICAL Co. LTD (Seoul, South Korea). "Semiconductor layer, method for manufacturing same... Read More

US Patent Issued to SPTS Technologies on Sept. 22 for "Method of operating a PVD apparatus" (British Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,577, issued on Sept. 22, was assigned to SPTS Technologies Ltd. (Newport, Great Britain). "Method of operating a PVD apparatus" was invent... Read More

US Patent Issued to Applied Materials on Sept. 22 for "Ion implantation for increased adhesion with resist material" (California, New York, Massachusetts Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,578, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Ion implantation for increased adhesion with resis... Read More

US Patent Issued to DISCO on Sept. 22 for "Processing method of bonded wafer" (Japanese Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,579, issued on Sept. 22, was assigned to DISCO Corp. (Tokyo). "Processing method of bonded wafer" was invented by Hayato Tanaka (Tokyo) an... Read More

US Patent Issued to International Business Machines on Sept. 22 for "Self-aligned litho-etch-litho-etch mandrel cut process for advanced FINFET interconnect" (New York Inventors)

Posted On: 2026-09-24

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ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,580, issued on Sept. 22, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Self-aligned litho-etch-litho-etch mandrel... Read More

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US Patent Issued to International Business Machines on Sept. 22 for "MRAM device with hexagonal shaped electrodes" (New York Inventors)

US Patent Issued to Regents of the University of Minnesota, Government of the United States of America and Theiss Research on Sept. 22 for "Scalable spintronic devices formed on silicon wafers" (Minnesota, Maryland, California Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Memory device including bottom electrode bridges and method of manufacture" (Taiwanese, American Inventors)

US Patent Issued to Imec vzw on Sept. 22 for "Quantum bit chip having a stack of qubit wafers and spacer wafers, and a method for fabricating the quantum bit chip" (Belgian Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Semiconductor device, memory cell and method of forming the same" (Taiwanese Inventors)

US Patent Issued to HANSOL CHEMICAL on Sept. 22 for "Semiconductor layer, method for manufacturing same, and transistor comprising same" (South Korean Inventors)

US Patent Issued to SPTS Technologies on Sept. 22 for "Method of operating a PVD apparatus" (British Inventors)

US Patent Issued to Applied Materials on Sept. 22 for "Ion implantation for increased adhesion with resist material" (California, New York, Massachusetts Inventors)

US Patent Issued to DISCO on Sept. 22 for "Processing method of bonded wafer" (Japanese Inventors)

US Patent Issued to International Business Machines on Sept. 22 for "Self-aligned litho-etch-litho-etch mandrel cut process for advanced FINFET interconnect" (New York Inventors)